Automatic Solder Paste Printing Machine Stencil P | RFQ Sourcing Details

China SMT Equipment Factory Automatic Solder Paste printing machine Stencil printing machine Screen Printing Machine with TUV Certificate for PCB Line Technical Parameters PCB parameters Maximum board size ( X x Y ) 450mm x 350mm Minimum board size ( Y x X ) 50mm x 50mm PCB thickness 0.4mm~6mm Warpage Max.

PCB ≤1%Diagonal Maximum board weight 6.

Kg Board margin gap Configuration to 3mm Maximum bottom gap 20mm Transfer speed 1500mm/s(Max) Transfer height from the ground 900±40mm Transfer orbit direction Left-Right,Right-Left,Left-Left,Right-Right Transfer mode One stage orbit PCB damping method Programmable elastic side clamp + Automatic adjustment PCB thickness+ Edge locking and pressing PCB (Option: 1.

Bottom integral cavity type vacuum;2.Bottom multi-point local vacuum) Support method Magnetic thimble + Equal high block.(Optional:1.vacuum suction cavity;2.special workpiece fixture) Printing parameters Printing head Floating in plate frame size 470mm x 370mm~737 mm x 737 mm Maximum printing area ( X x Y ) 450mm x 350mm Squegee type Steel Squegee/Rubber Squegee ( Angel 45°/50°/60° matching the printing process ) Squegee length 300mm (optional with length of 200mm-500mm) Squegee height 65±1mm Squegee thickness 0.25mm Diamond-like carbon coating Printing mode Single or double scraper printing Demoulding length 0.02 mm - 12 mm Printing speed 0 ~ 200 mm/s Printing pressure 0.5kg - 10.

Kg Printing stroke ±200 mm (From the center) Image parameters Field of view 6.4mm x 4.8mm Platform adjustment range X.Y:±7.0mm,θ:±2.0° Fiducial Types Standard Fiducial type( Circle, triangle, square, diamond, cross) (SMEMA standard ),solder pad/openings Camera system Independent camera,upwards/downwards imaging vision system,geometric matching location Performance parameters Repetition precision of image calibration ±10.0 micron @6 σ , Cpk ≥ 2.0 Repetition precision of printing ±15.0micron @6 σ , Cpk ≥ 2.0 Cycle time